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FR4 Printed Circuit Board FR4 4L PCB laminates with Rogers: BPM18157

  • Description:
    FR4 Printed Circuit Board FR4 4L PCB laminates with Rogers: BPM18157 All the high frequency substrates can be laminated with FR4, including Rogers with high reliability, good heat dissipation and low processing cost. This FR4 4L PCB laminates wi

FR4 Printed Circuit Board

FR4 4L PCB laminates with Rogers: BPM18157

All the high frequency substrates can be laminated with FR4, including Rogers with high reliability, good heat dissipation and low processing cost. This FR4 4L PCB laminates with Rogers 4003C which is applicable to micro-communication, 5G, military radar and other high frequency industry.

BPM18157- Multi-Layer FR4 PCB

Multi-Layer FR4 PCB BPM18157

Multi-Layer FR4 PCB BPM18157

Multi-Layer FR4 PCB BPM18157

Product Parameters
  • 4L PCB laminates with Rogers 4003C
  • Board thickness: 1.6mm
  • Outer copper thickness: 1.5OZ
  • Inner copper thickness: 0.5OZ
  • Surface finishing: ENIG
  • Soldermask: green
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